Background lines

Industry: OEM

Stop rediscovering defects
your team already resolved.

Your test history, validation records, and engineering knowledge hold the answers, but they're scattered across systems your team can't search together. Chip connects them so failure modes surface before they reach production.

VOLVO

CARS

“We stopped solving the same problem twice. Chip surfaces the prior resolution before an engineer even opens the ticket.”

QUALITY ENGINEERING · VOLVO CARS

01 · Connect & Learn

Chip arrives already knowing your full validation history.

On day one Chip connects to your test management, engineering, and knowledge systems and ingests every defect your team has resolved: what failed, what was tried, what fixed it, how long it took. It runs autonomous post-mortems across your full defect history before it touches a single live test failure.

  • Indexes test records, resolved defects, and engineering tickets together.
  • Runs post-mortems agenically, with no manual tagging or annotation required.
  • Identifies recurring failure modes, common root causes, and missed pre-production signals.
  • The moat is your data. It compounds with every defect resolved.

“A team starting fresh has a capable model and zero outcome history. Chip has 18 months of your specific test failures, resolutions, and patterns before it handles its first live defect. That's not a head start. That's a different product.”

chip — connected sources
6 sources · indexed
TestRail
3,841 test records
Jira
1,204 engineering tickets
GitHub
892 defect-linked commits
Confluence
447 engineering specs
Polarion
612 requirements
ServiceNow
238 change records
18 months

2,847 test cycles · post-mortems complete

TEST-2847 · event timelinethermal derating
TEST-2847 opened71%

Classify failure mode · match resolved defects · set root cause hypothesis

Engineer updates status86%

"Does this new context confirm or challenge the current root cause path?"

Related defect found93%

Cross-reference product line history · revise hypothesis · flag recurring pattern

Fix validated in test100%

Index outcome · update defect library · close loop with quality team

Chip matched 3 prior defects

TEST-2103Thermal derating · XC90 Gen4Resolved 14 Jan
TEST-1891Power rail instability · V60Resolved 09 Nov
TEST-1654Thermal protection triggerResolved 22 Sep

02 · Event-Driven Engine

Every test failure re-triggers root cause analysis. Continuously.

When a test fails, Chip doesn't just log it. It asks: “Does this match anything we've resolved before, on this product, a prior model year, or a similar subsystem?” If the hypothesis changes as new context arrives, the analysis updates. If an engineer links a related defect, quality gets a proactive note.

  • Triggers fire on test failure, status change, engineer update, and validation sign-off.
  • Each trigger re-runs relevant analysis nodes, not the whole pipeline.
  • Root cause confidence is tracked continuously and escalated when it drops.
  • Chip never waits to be asked. If something changes, it already knows.

03 · Custom Intelligence

Build an intelligence layer on top of your defect history.

Chip defines and applies custom labels across your entire test and defect history, not just new failures. Those labels drive routing to the right engineering team, group failures by root cause, trigger escalation rules, and surface trend data across model years and product lines.

  • Define custom failure mode labels mapped to your specific product lines and subsystems.
  • Retroactively apply labels to past test cycles to instantly surface patterns that were invisible.
  • Wire automations to labels: route, escalate, notify, or open engineering tickets automatically.
  • Run trend reports across any label. Which failure modes are accelerating across model years?

Labels and automations are built on the same pipeline architecture Chip uses internally, so anything Chip can do, you can wire up for your quality and engineering workflows.

thermal_derating_event
14 cases · 3 product lines
Route → Thermal Engineering
Attach → Thermal Runbook v3
If recurrence ≥ 3 → escalate to Chief Engineer
firmware_regression
7 cases · trending ↑
Priority → P1 override
Route → Embedded Systems Team
Open → Jira with full defect context
burst_overvoltage
5 cases
Route → Power Electronics
Escalation window → 4 hours
Auto-draft → validation summary for sign-off

OEM use cases

See how Chip works inside a hardware development team.

We'll walk through a live demo configured for validation and quality engineering, from test failure to root cause.